新闻与活动
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CEO Interview: Chip Equipment Supplier on a Rocket Trajectory
Metrology and inspection company Unity Semiconductor SAS (Grenoble, France), is experiencing strong growth and expects to double its sales year-on-year in 2017. We asked CEO Gilles Fresquet to explain why and provide some background. [eeNews Europe] Read more
Advanced Packaging & System Integration Technology Symposium
Wuxi, China Dario Alliata, Product Manager, will deliver a talk entitled "Advanced Packaging Process Control for High Volume Manufacturing". In addition, our Business Development team will be attending to meet with attendees and promote our product offer.
UnitySC Pushes the Boundaries of Measurement With New Nanotopography Metrology Platform
NST Series Provides Non-Contact Full Field Profilometry to 0.1nm Resolution; Delivers Unique Overlay Solution for Hybrid Bonding Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology...
ECTC
Lake Buena Vista, Florida ECTC is the premier international conference on microelectronic packaging, components, and systems technology. UnitySC is proud to be Gold Sponsor of ECTC. We will be exhibiting in booth #219 and showcasing our full product portfolio of...
SEMICON China
Shanghai New Expo International Center UnitySC will be exhibiting in booth #5375 in Hall #5. New product launch planned ! www.semiconchina.org/
IMAPS Device Packaging Conference
Fountain Hills, AZ, USA UnitySC will be sponsoring the Panel discussion about Fan Out Wafer Level Packaging. Please attend this session and get in touch with our staff during the event.
