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Unity SC (A FOGALE Nanotech Company) disclosed two new metrology solutions for advanced packaging applications
T-MAP 3D Time-domain Optical Coherence is the most robust solution for TSV depth, bow & warp and individual layer TTV of a stack measurement as each interface is detected in the right order over a larger range than spectral interferometry. The only limitation is...
Unitysc Acquires Hseb Dresden Gmbh to Become a Global Leader in Semiconductor Process Control
Combined Core Competencies Deliver comprehensive Inspection and Metrology Offering for FULL SPECTRUM OF SEMICONDUCTOR APPLICATIONS Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of...
2018 IEEE 68th Electronic Components and Technology Conference
San Diego, California This year again, UnitySC is proud to be Gold Sponsor of ECTC which brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. We will be...
IMAPS Device Packaging 2018
Fountain Hills, Arizona UnitySC will be exhibiting on booth #60. Dario Alliata, Product Manager will also deliver two talks respectively entitled Progress in Time-Domain Optical Coherence Tomography for TSV/3Di stacking Metrology and Wafer Nano Topography and Edge...
3D Architectures for Heterogeneous Integration and Packaging (3D ASIP)
San Francisco, USA Gilles Fresquet, CEO UnitySC, will deliver an invited talk entitled "TSV, FOWLP, Hybrid Bonding : Review of Metrology Challenges and Solutions to Support HVM". Check the event website for more information.
Why Ultra Thin Power Semiconductors Calls For Advanced Inspection Process Control
Article published in Silicon Semiconductor (Volume 39, Issue 4 2017) Thin and ultrathin ICs are in high demand, but yield that sacrifices reliability has little value. Inspection process control can be the solution, according to UnitySC. By Gilles Fresquet, CEO,...
