由 kaiss.benhadjsalem@unity-sc.com | 8 月 24, 2017 | News
Blog post from Philippe Gastaldo, Product and R&D Director, UnitySC. As the automotive electronics market continues to grow, spurred by developments such as semi-autonomous and fully autonomous vehicles, the demand is increasing for power semiconductor components...
由 kaiss.benhadjsalem@unity-sc.com | 8 月 4, 2017 | News
Article published by UnitySC in Chip Scale Review (July-Aug 2017, Volume 21, Number 4) With the increase of costs, delays and complexity at the most advanced frontend silicon technology nodes, advanced packaging process control solutions have become a key...
由 kaiss.benhadjsalem@unity-sc.com | 7 月 25, 2017 | News
Gilles Fresquet, CEO, and Yann Guillou, Global Marketing Manager, mentionned in the article written by Francoise von Trapp from 3DInCites In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on...
由 kaiss.benhadjsalem@unity-sc.com | 7 月 20, 2017 | Events
Munich, Germany For the first time, SEMICON Europa will be co-located with Productronica. UnitySC will be exhibiting on booth #B1-1008. To pre-arrange a meeting, send us a message.
由 kaiss.benhadjsalem@unity-sc.com | 7 月 20, 2017 | Events
San Jose, CA Wafer Level Packaging is almost everywhere: smartphones, automotive, IoT, medtech, etc… Meet with us at IWLPC on booth #10 and listen to our talk entitled “Wafer Thinning In-Line Inspection Process Control Solution for High Volume...
