由 kaiss.benhadjsalem@unity-sc.com | 6 月 8, 2017 | News
Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp from 3DInCites. The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took...
由 kaiss.benhadjsalem@unity-sc.com | 5 月 30, 2017 | News
What is expected from inspection and metrology equipment, and how will it evolve in the future? Advanced packaging has grown into a complex ecosystem with a variety of business models and a series of players involved, from initial wafer processing steps to final...
由 kaiss.benhadjsalem@unity-sc.com | 5 月 16, 2017 | News
Advanced packaging is now mainstream, but making sure these devices work properly while also cutting costs is getting harder. As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology...
由 kaiss.benhadjsalem@unity-sc.com | 5 月 9, 2017 | Press releases
Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading...
由 kaiss.benhadjsalem@unity-sc.com | 5 月 3, 2017 | Events
San Francisco, CA 1 year ago, UnitySC was launched at SEMICON West 2016. What a busy year with so many achievements since July 2016! Stop by our booth to learn about our full advanced process control product portfolio for heterogeneous integration. UnitySC will be...