由 kaiss.benhadjsalem@unity-sc.com | 2 月 19, 2018 | Events
San Diego, California This year again, UnitySC is proud to be Gold Sponsor of ECTC which brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. We will be...
由 kaiss.benhadjsalem@unity-sc.com | 2 月 14, 2018 | Events
Fountain Hills, Arizona UnitySC will be exhibiting on booth #60. Dario Alliata, Product Manager will also deliver two talks respectively entitled Progress in Time-Domain Optical Coherence Tomography for TSV/3Di stacking Metrology and Wafer Nano Topography and Edge...
由 kaiss.benhadjsalem@unity-sc.com | 12 月 1, 2017 | Events
San Francisco, USA Gilles Fresquet, CEO UnitySC, will deliver an invited talk entitled “TSV, FOWLP, Hybrid Bonding : Review of Metrology Challenges and Solutions to Support HVM”. Check the event website for more information.
由 kaiss.benhadjsalem@unity-sc.com | 7 月 20, 2017 | Events
Munich, Germany For the first time, SEMICON Europa will be co-located with Productronica. UnitySC will be exhibiting on booth #B1-1008. To pre-arrange a meeting, send us a message.
由 kaiss.benhadjsalem@unity-sc.com | 7 月 20, 2017 | Events
San Jose, CA Wafer Level Packaging is almost everywhere: smartphones, automotive, IoT, medtech, etc… Meet with us at IWLPC on booth #10 and listen to our talk entitled “Wafer Thinning In-Line Inspection Process Control Solution for High Volume...
由 kaiss.benhadjsalem@unity-sc.com | 7 月 20, 2017 | Events
Raleigh, NC UnitySC will be exhibiting on booth #421 and delivering a talk entitled “In line Advanced Process Control Solution for the Fabrication of Micro-bumps”. Come to meet with us. To pre-arrange a meeting, send us a message.
