由 kaiss.benhadjsalem@unity-sc.com | 7 月 23, 2019 | News, Press releases
CEA-Leti and UnitySC Announce Further Development To Fuel Industry 4.0 with Smarter Tools SAN FRANCISCO – July 10, 2019 – Leti, a research institute of CEA Tech, and UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology...
由 kaiss.benhadjsalem@unity-sc.com | 5 月 21, 2019 | Asia, News
Unity SC is delighted to announce that the company has expended to open a new office in Singapore ! Singapore, the 15th May 2019 – Unity SC, a leading Metrology and Inspection company at the forefront of supporting the Global Semiconductor industry, has...
由 kaiss.benhadjsalem@unity-sc.com | 4 月 16, 2019 | News, Press releases
To see the complete article, you can download the magazine here : 3D InCities The First Decade Magazine The expected increase of power device markets — and more particularly insulated-gate bipolar transistor (IGBT) products for automotive and other applications — is...
由 kaiss.benhadjsalem@unity-sc.com | 4 月 3, 2018 | News
T-MAP 3D Time-domain Optical Coherence is the most robust solution for TSV depth, bow & warp and individual layer TTV of a stack measurement as each interface is detected in the right order over a larger range than spectral interferometry. The only limitation is...
由 kaiss.benhadjsalem@unity-sc.com | 11 月 22, 2017 | News
Article published in Silicon Semiconductor (Volume 39, Issue 4 2017) Thin and ultrathin ICs are in high demand, but yield that sacrifices reliability has little value. Inspection process control can be the solution, according to UnitySC. By Gilles Fresquet, CEO,...
由 kaiss.benhadjsalem@unity-sc.com | 11 月 9, 2017 | News
有人已经考虑将暗视野检测用于检测薄晶圆缺陷。基于光学技术，暗视野是指进行较低角度反射光测量。 暗视野对于晶圆前端检测是有效的，但是由于研磨造成晶圆背面粗糙，对于背面检测它是无效的。因此，晶圆背面研磨后应避免暗视野检测。 Read...
