由 kaiss.benhadjsalem@unity-sc.com | 11 月 9, 2017 | News
Francoise von Trapp (3D Incites) refers to UnitySC’s latest announcement in her coverage of IWLPC. After reading the announcement of UnitySC’s opening of its new software development lab and customer support demo lab, I caught up with the Philippe Gastaldo,...
由 kaiss.benhadjsalem@unity-sc.com | 8 月 24, 2017 | News
Blog post from Philippe Gastaldo, Product and R&D Director, UnitySC. As the automotive electronics market continues to grow, spurred by developments such as semi-autonomous and fully autonomous vehicles, the demand is increasing for power semiconductor components...
由 kaiss.benhadjsalem@unity-sc.com | 8 月 4, 2017 | News
Article published by UnitySC in Chip Scale Review (July-Aug 2017, Volume 21, Number 4) With the increase of costs, delays and complexity at the most advanced frontend silicon technology nodes, advanced packaging process control solutions have become a key...
由 kaiss.benhadjsalem@unity-sc.com | 7 月 25, 2017 | News
Gilles Fresquet, CEO, and Yann Guillou, Global Marketing Manager, mentionned in the article written by Francoise von Trapp from 3DInCites In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on...
由 kaiss.benhadjsalem@unity-sc.com | 6 月 28, 2017 | News
Most would agree that in order for advanced packaging solutions to lead the industry and fill the role previously held by semiconductor scaling it must see advances in infrastructure building and significant focus by all players to lower costs. For sure, this will...
由 kaiss.benhadjsalem@unity-sc.com | 6 月 19, 2017 | News
Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp from 3DInCites. […] UnitySC filled me in on their most recent inspection platform targeting heterogeneous integration, the 4See Series, an all-surface wafer inspection...
