by kaiss.benhadjsalem@unity-sc.com | Jul 20, 2017 | Events
Taipei Nangang Exhibition Center, Taiwan Taiwan is a key region for UnitySC with many customers and tools installed. From Sept 13 to 15th, we will be co-exhibiting with our local representative, Kingyoup Entreprises. Visit us on booth #930, 4th floor, and learn more...
by kaiss.benhadjsalem@unity-sc.com | Jun 28, 2017 | News
Most would agree that in order for advanced packaging solutions to lead the industry and fill the role previously held by semiconductor scaling it must see advances in infrastructure building and significant focus by all players to lower costs. For sure, this will...
by kaiss.benhadjsalem@unity-sc.com | Jun 19, 2017 | News
Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp from 3DInCites. […] UnitySC filled me in on their most recent inspection platform targeting heterogeneous integration, the 4See Series, an all-surface wafer inspection...
by kaiss.benhadjsalem@unity-sc.com | Jun 8, 2017 | News
Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp from 3DInCites. The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took...
by kaiss.benhadjsalem@unity-sc.com | May 30, 2017 | News
What is expected from inspection and metrology equipment, and how will it evolve in the future? Advanced packaging has grown into a complex ecosystem with a variety of business models and a series of players involved, from initial wafer processing steps to final...
