by kaiss.benhadjsalem@unity-sc.com | Mar 14, 2017 | Press releases
NST Series Provides Non-Contact Full Field Profilometry to 0.1nm Resolution; Delivers Unique Overlay Solution for Hybrid Bonding Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology...
by kaiss.benhadjsalem@unity-sc.com | Feb 21, 2017 | Events
Lake Buena Vista, Florida ECTC is the premier international conference on microelectronic packaging, components, and systems technology. UnitySC is proud to be Gold Sponsor of ECTC. We will be exhibiting in booth #219 and showcasing our full product portfolio of...
by kaiss.benhadjsalem@unity-sc.com | Feb 21, 2017 | Events
Shanghai New Expo International Center UnitySC will be exhibiting in booth #5375 in Hall #5. New product launch planned ! www.semiconchina.org/
by kaiss.benhadjsalem@unity-sc.com | Feb 15, 2017 | Events
Fountain Hills, AZ, USA UnitySC will be sponsoring the Panel discussion about Fan Out Wafer Level Packaging. Please attend this session and get in touch with our staff during the event.
by kaiss.benhadjsalem@unity-sc.com | Feb 14, 2017 | News
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM),...
