by kaiss.benhadjsalem@unity-sc.com | Mar 20, 2018 | Press releases
Combined Core Competencies Deliver comprehensive Inspection and Metrology Offering for FULL SPECTRUM OF SEMICONDUCTOR APPLICATIONS Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of...
by kaiss.benhadjsalem@unity-sc.com | Feb 19, 2018 | Events
San Diego, California This year again, UnitySC is proud to be Gold Sponsor of ECTC which brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. We will be...
by kaiss.benhadjsalem@unity-sc.com | Feb 14, 2018 | Events
Fountain Hills, Arizona UnitySC will be exhibiting on booth #60. Dario Alliata, Product Manager will also deliver two talks respectively entitled Progress in Time-Domain Optical Coherence Tomography for TSV/3Di stacking Metrology and Wafer Nano Topography and Edge...
by kaiss.benhadjsalem@unity-sc.com | Dec 1, 2017 | Events
San Francisco, USA Gilles Fresquet, CEO UnitySC, will deliver an invited talk entitled “TSV, FOWLP, Hybrid Bonding : Review of Metrology Challenges and Solutions to Support HVM”. Check the event website for more information.
by kaiss.benhadjsalem@unity-sc.com | Nov 22, 2017 | News
Article published in Silicon Semiconductor (Volume 39, Issue 4 2017) Thin and ultrathin ICs are in high demand, but yield that sacrifices reliability has little value. Inspection process control can be the solution, according to UnitySC. By Gilles Fresquet, CEO,...
