by kaiss.benhadjsalem@unity-sc.com | Jun 19, 2017 | News
Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp from 3DInCites. […] UnitySC filled me in on their most recent inspection platform targeting heterogeneous integration, the 4See Series, an all-surface wafer inspection...
by kaiss.benhadjsalem@unity-sc.com | Jun 8, 2017 | News
Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp from 3DInCites. The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took...
by kaiss.benhadjsalem@unity-sc.com | May 30, 2017 | News
What is expected from inspection and metrology equipment, and how will it evolve in the future? Advanced packaging has grown into a complex ecosystem with a variety of business models and a series of players involved, from initial wafer processing steps to final...
by kaiss.benhadjsalem@unity-sc.com | May 16, 2017 | News
Advanced packaging is now mainstream, but making sure these devices work properly while also cutting costs is getting harder. As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology...
by kaiss.benhadjsalem@unity-sc.com | Mar 30, 2017 | News
Metrology and inspection company Unity Semiconductor SAS (Grenoble, France), is experiencing strong growth and expects to double its sales year-on-year in 2017. We asked CEO Gilles Fresquet to explain why and provide some background. [eeNews Europe] Read...
by kaiss.benhadjsalem@unity-sc.com | Feb 14, 2017 | News
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM),...
