Discover the Electronics business of Merck KGaA, Darmstadt, Germany

WE ENABLE OUR CUSTOMERS TO YIELD HIGHER & FASTER

WHO ARE UNITYSC?

UnitySC was formed in 2016, by a combination of European companies. Headquarted in France, UnitySC has a worldwide footprint, with staff in every major chip producing region.

WHAT DOES UNITYSC MAKE? 

UnitySC is a leader in creating Metrology & Inspection tools used for Advanced Packaging (TSVs, High BandWidth Memory Chip stacks, Hybrid-Bonding/Wafer2Wafer, Die2Wafer) & MEM’s.

We also make equipment for unpatterend wafer defect inspection (all types of Compound-semi substrates like GaN, GaAs, InP, SiC, Glass, Sapphire, Ge, Silicon). 

Plus other Metrology & Inspection equipment for other use-cases, all of which are used by our customers for yield improvement.

WORKING AT UNITYSC

At UnitySC, we promote and support from a diverse talent pool. We are pushing the frontiers of technology, making us an attractive place to work that allows all our employees to grow and succeed.

UNITYSC’S SERVICES

UnitySC are able to offer resources for Service & Applications Support for our equipment to customers all over the world.

We provide a comprehensive range of maintenance, upgrade and other services, depending on your requirements. Through these services, we can continuously maintain the health of your tools over their lifetimes.

Our Spare Parts Team offers a quick and reliable service to keep your production lines moving.

EXAMPLES OF OUR CUSTOMERS’ END MARKETS

Automotive

The move from ICE vehicles to E-vehicles, Autonomous driving (eg; ADAS), in-car-tech, digital connectivity & security. All these trends have one common enabler: Semiconductor components.

High-Bandwidth Memory (HBM)

High-Performance Computing (HPC)

AI-driven data analytics require real-time data processing at scale. UnitySC optimizes Semiconductor industry computing and memory architectures (GPU & CPU) for efficient handling of large and time-critical datasets.

Enhancing overall performance in data analytics, more efficiently and securely handled.

Internet Of Things

IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the world of tomorrow. In short, more & more physical products will contain more & more chips of all types of functions.

AI & Augmented

Virtual Reality

Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences.

These technologies require smaller form factors, higher performance chip-materials and novel packaging approaches.

What’s new

Press releases

Events

SEMI MEMS and Sensors Summit 2017

Grenoble, France 3rd edition of the SEMI MEMS and Sensor Summit will take place in Grenoble from Sept 20th to 22nd. Looking for versatile process control solutions compliant with high volume manufacturing ? Stop by our booth #21 to learn about our TMap Series and 4See...

SEMICON Taiwan 2017

Taipei Nangang Exhibition Center, Taiwan Taiwan is a key region for UnitySC with many customers and tools installed. From Sept 13 to 15th, we will be co-exhibiting with our local representative, Kingyoup Entreprises. Visit us on booth #930, 4th floor, and learn more...

News

克服大批量薄晶圆制造中的检测挑战

有人已经考虑将暗视野检测用于检测薄晶圆缺陷。基于光学技术,暗视野是指进行较低角度反射光测量。 暗视野对于晶圆前端检测是有效的,但是由于研磨造成晶圆背面粗糙,对于背面检测它是无效的。因此,晶圆背面研磨后应避免暗视野检测。 Read...

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