BIG NEWS!
Unity-SC is now part of the Electronics business of Merck KGaA, Darmstadt, Germany
Where Metrology & Inspection Meet Materials Intelligence™
WE ENABLE OUR CUSTOMERS TO YIELD HIGHER & FASTER
WHO ARE UNITYSC?
UnitySC was formed in 2016, by a combination of European companies. Headquarted in France, UnitySC has a worldwide footprint, with staff in every major chip producing region.
WHAT DOES UNITYSC MAKE?
UnitySC is a leader in creating Metrology & Inspection tools used for Advanced Packaging (TSVs, High BandWidth Memory Chip stacks, Hybrid-Bonding/Wafer2Wafer, Die2Wafer) & MEM’s.
We also make equipment for unpatterend wafer defect inspection (all types of Compound-semi substrates like GaN, GaAs, InP, SiC, Glass, Sapphire, Ge, Silicon).
Plus other Metrology & Inspection equipment for other use-cases, all of which are used by our customers for yield improvement.
WORKING AT UNITYSC
At UnitySC, we promote and support from a diverse talent pool. We are pushing the frontiers of technology, making us an attractive place to work that allows all our employees to grow and succeed.
UNITYSC’S SERVICES
UnitySC are able to offer resources for Service & Applications Support for our equipment to customers all over the world.
We provide a comprehensive range of maintenance, upgrade and other services, depending on your requirements. Through these services, we can continuously maintain the health of your tools over their lifetimes.
Our Spare Parts Team offers a quick and reliable service to keep your production lines moving.
EXAMPLES OF OUR CUSTOMERS’ END MARKETS
Automotive
The move from ICE vehicles to E-vehicles, Autonomous driving (eg; ADAS), in-car-tech, digital connectivity & security. All these trends have one common enabler: Semiconductor components.
High-Bandwidth Memory (HBM)
High-Performance Computing (HPC)
AI-driven data analytics require real-time data processing at scale. UnitySC optimizes Semiconductor industry computing and memory architectures (GPU & CPU) for efficient handling of large and time-critical datasets.
Enhancing overall performance in data analytics, more efficiently and securely handled.
Internet Of Things
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the world of tomorrow. In short, more & more physical products will contain more & more chips of all types of functions.
AI & Augmented
Virtual Reality
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences.
These technologies require smaller form factors, higher performance chip-materials and novel packaging approaches.
What’s new
Press releases
IMAPS Conference in Boston (Sept 30- Oct 3)
During the 52th IMAPS conference held in Boston from the 30th of September until the 3rd of October, Unity Semiconductor will present a paper entitled : How to secure the fabrication of Gallium Nitride on Si wafers You can already read below an abstract of what we...
ASMC Conference – Optical profilometry and AFM measurements comparison on low amplitude deterministic surfaces
Dr Carlos Beitia from CEA LETI has presented a paper about advanced metrology in collaboration with Unity during the Advanced Semiconductor Manufacturing Conference in New york. New York, 6th-9th May 2019- Surface nanotopography is important for different key advanced...
Events
ASMC Conference – Optical profilometry and AFM measurements comparison on low amplitude deterministic surfaces
Dr Carlos Beitia from CEA LETI has presented a paper about advanced metrology in collaboration with Unity during the Advanced Semiconductor Manufacturing Conference in New york. New York, 6th-9th May 2019- Surface nanotopography is important for different key advanced...
UnitySC will participate to the MINaPAD forum conferences
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » is a 2 days conference with an exhibition, which be held in Grenoble, France, on WTC congress center on May 21-22-23, 2019. The objective of this event is to reinforce the...
News
Inspection and metrology challenges for power device manufacturing
Driven by automotive market growing, power devices are now requested to fulfill the Zero-Defect policy edicted by Power Device Manufacturers leading the market. Much more than adapting old technologies and equipment to this new challenge, specific solutions are...
LIGHTSpEED by UNiTYSC: The new high-end surface inspection solution for in-line monitoring and process qualification of opaque and transparent substrates
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced synchronous doppler detection technology to capture nanometer scale defects on all kind of wafers. Grenoble, France – Tuesday, July 9th, 2019 – UnitySC,...
