MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » is a 2 days conference with an exhibition, which be held in Grenoble, France, on WTC congress center on May 21-22-23, 2019.
The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
– Parallel technical sessions
– An exhibition.
– Additional technical events (May 21, 2019)
Mathieu Noël, our Metrology Product Manager in UnitySC will present the Metrology for High Density Wafer Level Fan-Out & TSV based stacking at 15h20 on the 22th of May 2019.
To get more information about this event, click here : http://www.france.imapseurope.org
See the conferences program here : 2019 Minapad Program
